World expert in molding equipment
Meet advanced tools for semiconductor molding. Our products are designed with precision and innovation to maximize performance and reliability.
About Us
XSpirit Semi was established in October 2005. It is mainly engaged in the research and development, production and sales of intelligent manufacturing equipment used in the fields of plastic extrusion molding and semiconductor packaging. It provides customers with customized intelligent manufacturing equipment and system solutions. Its main products are plastic extrusion molding molds, extrusion molding devices and downstream equipment, semiconductor packaging equipment and molds.
Product list
Explore our range of microelectronic equipment with images, specifications and descriptions.
CSN 60 Full-Auto Compression Molding System
Through reliable structural design, the ultra-high precision parallelism of the press platform is achieved and the high uniformity of the packaged products is achieved. According to customer choice, various packaging forms of substrates and frames can be realized in Max100x300mm level.
CWN-90 Manual WLP Molding System
Use a high-precision direct-moving servo motor drive system to achieve accurate operation of equipment operation and ensure the accuracy of wafer plastic sealing; Through reliable structural design, the ultra-high precision parallelism of the press platform is achieved and the uniformity of packaging products is achieved; this equipment can be selected by customers to realize a variety of packaging forms of 12inch level Wafer and Panel.
CWN-90 Full-Auto WLP Molding System
Use a high-precision direct-acting servo motor drive system to achieve accurate operation of equipment operation and ensure the accuracy of wafer plastic sealing; Through reliable structural design, stable loading and unloading conveying and ultra-high precision parallelism of the press platform are achieved, and uniformity of packaging products can be achieved according to customer choices. This equipment can be used to achieve various packaging of 8-12inch waffer and Panel at 8-12inch level. form.
MNNC 120/180 Manual Transfer Molding System
120ton manual transfer molding equipment, suitable for molding laboratories or small batch production
ANNC 120 Full-Auto Transfer Molding System
ANNC 120 fully automatic molding equipment takes the latest packaging technology as the entry point, adopts the latest computer interface and controller, and is simple to use, and its accuracy, safety and stability are completely comparable to imported equipment; ANNC 120 fully automatic molding equipment has various special functions to meet customer needs, and can provide customized solutions according to customer product characteristics, process requirements, etc.
ANNC 180 Full-Auto Transfer Molding System
Taking the latest molding technology as the entry point, the latest computer interface and controller are adopted, the mold clamping pressure range is 20~180ton, and the corresponding maximum frame size is: W: 100mm × L: 300mm. Accuracy, safety and stability are comparable to imported equipment.
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